11:28 Jul 8, 2004 |
Russian to English translations [PRO] Tech/Engineering - Manufacturing | |||||||
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| Selected response from: Olga Judina Latvia Local time: 11:30 | ||||||
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3 | reflow [soldering] according to thermal profile |
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оплавление с соблюдением термопрофиля reflow [soldering] according to thermal profile Explanation: reflow using thermal profile Reflow Process of heating solder preforms or solder creams to form joints. (Melting) www.loctite-europe.com/electronics/Glossary/ElectronicsGlos... thermal profile A time versus temperature graph that displays the temperatures an assembly is subjected to over time in an oven during processes such as reflow soldering or the curing of adhesives, encapsulants, and conformal coatings. www.tkb-4u.com/glossarylist/glossary_tz.php The key to good reflow is a precise multistep thermal profile, as illustrated in Figure 1. Figure 1—In order to achieve reliable solders and to minimize thermal stress on components, a precise thermal profile must be used with four successive steps. http://www.circuitcellar.com/library/print/0704/Lacoste_168/ Reflow soldering A method of soldering involving application of solder prior to the actual joining. To solder, the parts are joined and heated, causing the solder to remelt, or reflow. www.eleceng.adelaide.edu.au/Personal/alsarawi/Packaging/nod... A method of electronics soldering commonly used with surface mount technology, whereby a paste formed of solder powder and flux suspended in an organic vehicle is melted by the application of external heat. www.etfinancial.com/solventgloss.htm Thermal Profiling in Reflow Soldering -- ECD Thermal Profiling in Reflow Soldering. by Rick Eissinger. When you can measure what you are speaking about, and express it in numbers ... www.ecd.com/emfg/instruments/tech2.asp -------------------------------------------------- Note added at 48 mins (2004-07-08 12:17:05 GMT) -------------------------------------------------- www.research-intl.com/reflowhandbook/section3.pdf What is a Temperature or Thermal Profile? High quality, low defect soldering requires identifying the optimum temperature profile for reflowing the solder paste. Achieving SMT process consistency means repeating this profile over and over. Every solder joint on every board needs to be heated similarly if the desired soldering results are to be accomplished. From the solder\'s point of view, it does not matter what the heat source to the solder joint is. What does matter is that the heat is applied to the solder joint in a controlled manner. The heating and cooling rise rates must be compatible with the solder paste and components. The amount of time that the assembly is exposed to certain temperatures must be defined and maintained. In other words, the solder reflow profile must first be defined and then maintained. Reference: http://www.ecd.com/emfg/instruments/tech2.asp |
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