English to Czech Tech/Engineering Engineering (general) electroplating

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"SILVERJET™ AI Additive contains active materials to inhibit the immersion of silver onto copper and copper alloy substrates.
Additions of SILVERJET 300 SD AI Additive generally result in a slight decrease in deposit reflectivity (GAM).
Occurrence of die mount epoxy bleed is directly proportional to the concentration of SILVERJET 300 SD AI Additive.
Therefore the concentration of SILVERJET 300 SD AI Additive should be maintained at the lowest level possible which will prevent silver immersion.
A maximum of 3 mL/L SILVERJET 300 SD AI Additive should be added in order to minimise bleed complications.
The concentration of SILVERJET 300 SD AI Additive can be reduced significantly by standard carbon treatment.
In the case of nickel and nickel alloy substrates the use of either a silver or copper strike plate is recommended.
Silver and silver plated substrates do not require addition of SILVERJET 300 SD Al Additive."