English to Persian (Farsi) Other Electronics / Elect Eng

The press-pack packaging
technology improves the connection of chips by direct press-pack contacting, which leads to
improved reliability (yet to be scientifically proved but known from industrial experience), higher
power density (easier stacking for series connection) and better cooling capability with the
disadvantage of higher cost. Press-pack IGCTs were first introduced into the medium-voltage
motor drives in the 1990’s and has already become state-of-the-art technology in the applications
of oil, gas, HVDC, power quality, etc.